Method of making package including stress relief structures and package

ABSTRACT

A package includes a substrate. The package further includes a first die on the substrate. The package further includes a second die on the substrate. The package further includes a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance. The package further includes a second stress relief structure on the substrate, wherein a distance between the second stress relief structure to the first distance, and the second stress relief structure is separated from the first stress relief structure.

PRIORITY CLAIM

The present application is continuation of U.S. application Ser. No. 16/728,305, filed Dec. 27, 2019, which is a continuation of U.S. application Ser. No. 15/810,602, filed Nov. 13, 2017, now U.S. Pat. No. 10,522,477, issued Dec. 31, 2019, which is a continuation of U.S. application Ser. No. 15/062,570, filed Mar. 7, 2016, now U.S. Pat. No. 9,818,700, issued Nov. 14, 2017, which is a divisional of U.S. application Ser. No. 13/673,703, filed Nov. 9, 2012, now U.S. Pat. No. 9,312,193, issued Apr. 12, 2016, which are incorporated herein by reference in their entireties.

FIELD

The disclosure relates generally to the field of packaging structures, and more particularly, to stress relief structures for reducing warpage in package assemblies.

BACKGROUND

Modern integrated circuits are formed on semiconductor chips. To increase manufacturing throughput and to lower manufacturing costs, the integrated circuits are manufactured in semiconductor wafers, each containing many identical semiconductor chips. After the integrated circuits are manufactured, semiconductor chips are sawed from the wafers and packaged before they can be used.

In typical packaging processes, semiconductor chips or dies are first attached to package substrates. This includes physically securing the semiconductor chips on the package substrates, and connecting bond pads on the semiconductor chips to bond pads on the package substrates. Underfill, which typically comprises epoxy, is used to further secure the bonding. The semiconductor chips may be bonded using either flip-chip bonding or wire bonding.

After the semiconductor chips are bonded onto the package substrates, the solder regions that join the semiconductor chips with the package substrates often suffer from cracking. This is caused by the stress resulting from the difference in coefficients of thermal expansion (CTE) between the package substrates and the semiconductor chips. The difference in CTEs of different layers of the package substrates and the semiconductor chips also results in stresses. The increase in the size of the package substrates and the semiconductor chips results in stress increase. As a result of the increased stresses, the solder cracking becomes more severe and delamination may occur between different layers of the semiconductor chips. Particularly, the delamination is likely to occur between low-k dielectric layers in the semiconductor chips.

BRIEF DESCRIPTION OF DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a top view of a semiconductor package structure with a stiffener ring surrounding a plurality of dies.

FIG. 2 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to one embodiment of the present disclosure.

FIG. 3a-3j are top views of various shapes of the stress relief structures, according to various aspects of the present disclosure.

FIG. 4 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to one embodiment of the present disclosure.

FIG. 5 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to one embodiment of the present disclosure.

FIG. 6 is a cross-sectional view of the semiconductor package structure of FIG. 5.

FIG. 7 is a graph showing a curve representing stress reduction when various dimensions of stress relief structures are implemented in a semiconductor package, according to an aspect of the present invention.

DETAILED DESCRIPTION

In the following description, specific details are set forth to provide a thorough understanding of embodiments of the present disclosure. However, one having an ordinary skill in the art will recognize that embodiments of the disclosure can be practiced without these specific details. In some instances, well-known structures and processes are not described in detail to avoid unnecessarily obscuring embodiments of the present disclosure.

Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be appreciated that the following figures are not drawn to scale; rather, these figures are merely intended for illustration.

Shown in FIG. 1 is a top view of a semiconductor package structure 10 with a stiffener ring 30 extending about a perimeter of substrate 20 and surrounding a plurality of dies D1, D2, D3, and D4 on the substrate 20 The stiffener ring 30 seals the dies D1, D2, D3, and D4 from moisture and provides a level of mechanical strength to the semiconductor package structure 10. Stiffener ring 30 provides for global warpage control of the semiconductor package structure 10 but may not be sufficient to control local warpages in or around the areas of individual dies D1, D2, D3, and D4. Furthermore, where there is a large die D3 compared to the other dies D1, D2, and D4, the warpage around die D3 may not be adequately controlled by one stiffener ring 30.

FIG. 2 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to one embodiment of the present disclosure. Semiconductor package structure 10 includes the plurality of dies D1, D2, D3, and D4 disposed on the substrate 20 and a plurality of stress relief structures 40 disposed around the dies D1, D2, D3, and D4. Stress relief structures 40 provide local stress relief and/or warpage control to semiconductor package structure 10 that may be caused by stress resulting from the difference in coefficients of thermal expansion (CTE) between the substrate 20 and dies D1, D2, D3, and/or D4. Further, stress relief structures 40 may improve the stress redistribution in semiconductor package structure 10 so that local stresses may be redistributed to other regions of the semiconductor package structure. According to one embodiment, stress relief structure 40 is disposed at at least one corner of substrate 20 with at least one of the dies D1, D2, D3 or D4 being adjacent to the stress relief structure 40. The stress relief structure 40 provides for stress relief at that particular corner. According to another embodiment, a stress relief structure 40 is disposed at the four corners of substrate 20, with at least one of the dies D1, D2, D3, or D4 being adjacent to a stress relief structure 40. The spacing S between a die and a stress relief structure 40 may be greater than about 2 μm, or even greater than about 3 μm, to prevent stress relief structure 40 from being shorted to dies D1, D2, D3, or D4. It is realized, however, that the dimensions recited throughout the description are merely examples, and may be changed to other suitable values.

According to one or more embodiments, stress relief structures 40 may be formed using photolithography, patterning, and etching techniques. Stress relief structures 40 may be disposed on substrate 20 by means of an adhesive material (not shown) and may comprise any material suitable for attaching stress relief structure 40 onto substrate 20, such as epoxies, urethane, polyurethane, silicone elastomers, and the like. According to one embodiment, the bonding of stress relief structures 40 onto substrate 20 includes coating an adhesive material on a surface of substrate 20. According to one or more embodiments, a curing process may then be performed to cure the adhesive material. The adhesive material may also have a good thermal conductivity, for example, greater than about 10 w/m-° C.

Stress relief structure 40 may be formed of a thermally conductive material such as for example, metal, tungsten, aluminum, aluminum alloy, polysilicon, silicide, tantalum, refractory metal, copper, copper alloy, gold, gold alloy, tantalum nitride, titanium, titanium nitride, nickel, compounds thereof, alloys thereof, or combinations thereof. The scope of the present disclosure is not limited to the above-mentioned materials and other materials are also contemplated such as, for example ceramic, solder, or plastic. The materials used for the stress relief structures 40 may be the same throughout the stress relief structures 40 or may vary at different locations in the stress relief structures 40.

According to one or more embodiments, stress relief structures 40 may have good thermal conductivity, which may be greater than about 20 W/m-° C., for example. Alternatively, stress relief structures 40 have a thermal conductivity equal to or greater than the thermal conductivity of silicon. According to some embodiments, stress relief structure 40 includes substantially a same material as either substrate 20 or dies D1, D2, D3, or D4.

According to one or more embodiments, stress relief structure 40 may have irregular or regular shapes, such as, for example a rectangle (FIG. 3a ), an L-shape (FIG. 3b ), a T-shape (FIG. 3c ), a broken strip (FIG. 3d ), a rectangular array (FIG. 3e ), a cross (FIG. 3f ), a square (FIG. 3g ), a triangle (FIG. 3h ), a circle (FIG. 3i ), and a polygon (FIG. 3j ). A combination of the above-mentioned shapes or other shapes based on the spirit of the present disclosure and suitable for reducing the stress caused by the CTE mismatch between the substrate and the die(s) are also contemplated. Stress relief 40 may also have random sizes, random shapes, random thicknesses, and/or random orientations and may be placed randomly in location and orientation. Preferably, stress relief structures 40 will be maximized in accordance with design rules for the layout of the semiconductor package structure.

Still referring to FIG. 1, according to another embodiment of the present invention, stress relief structure 40 is disposed on a periphery of substrate 20, at approximately a mid-section thereof, with at least one of the dies D1, D2, D3, or D4 being adjacent to a stress relief structure 40. According to another embodiment, a stress relief structure 40 is disposed on a periphery of substrate 20, at approximately two or more mid-sections thereof, with at least one of the dies D1, D2, D3, or D4 being adjacent to a stress relief structure 40.

FIG. 4 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to another embodiment of the present disclosure. Semiconductor package structure 10 includes a plurality of dies D1, D2, D3, and D4 disposed on a substrate 20, with die D3 being the largest die and a plurality of stress relief structures 40 disposed on substrate 20. A stress relief structure 40 is disposed at at least one corner, e.g., a corner of die D3, providing for stress relief at the particular corner of die D3. According to another embodiment, a stress relief structure 40 is disposed at the four corners of die D3, providing for stress relief at the four corners of die D3. As discussed above, a stiffener ring provides for global warpage control of the semiconductor package structure but may not be sufficient to control local warpages in or around the areas of individual dies D1, D2, D3, and D4, especially if the die is a large die compared to the other dies.

FIG. 5 is a top view of a semiconductor package structure illustrating a layout of stress relief structures on a substrate, according to another embodiment of the present disclosure. A stress relief structure 40 is disposed in close proximity to at least one of the dies D1, D2, D3, or D4 with the stress relief structure 40 being a strip extending substantially from close to one edge of the substrate 20 to an opposite edge of the substrate 20. One or more stress relief structure 40 may run between any two or more dies, according to one embodiment. FIG. 6 is a cross-sectional view of the semiconductor package structure 10 of FIG. 5 illustrating a stress relief structure 40 running between dies D3 and D4.

Experiments have been performed to evaluate the effect of the stress relief structures on the stress reduction of the semiconductor package structure. FIG. 7 is a graph showing a curve representing stress reduction when various dimensions of stress relief structures are implemented in a semiconductor package structure, according to an aspect of the present invention. The vertical axis represents a stress value and the horizontal axis represents a variable A/D ration (%). It was observed that the reduction of a maximum stress value of the die is dependent on a stress relief structure width [A]. Furthermore, the stress relief structure width [A] may be designed according to various die with D. As shown in FIG. 7, the higher the ratio of A to die width D results in a higher stress reduction. As indicated by a downward arrow, there is a 23% stress reduction from baseline to 10%. The results indicate that stress relief structures 40 have a significant effect in reducing the stress of the semiconductor package structure and therefore enhancing the reliability of the semiconductor package structure.

According to one or more embodiments, the selecting of the placements of the stress relief structures 40 may be performed automatically using a software algorithm. The selecting of the placements using the software algorithm may be performed in accordance with at least one predetermined design rule taking into account the minimum spacing around a particular die. Further, the selecting of the placements using the software algorithm may be performed by a layout tool during a layout process.

One or more embodiments of the present disclosure may provide numerous advantages, including (but not limited to) reducing the stress caused by the difference in coefficients of thermal expansion (CTE) between the package substrate and one or more dies. Teachings of the present disclosure are particularly applicable to large semiconductor package structures where with the increase in the size of the package substrates and the dies, the stress increases. As a result of the increased stresses, the solder cracking becomes more severe and delamination may occur between different layers of the chips. One or more embodiments of the present disclosure help strengthen the semiconductor package structure and helps reduce the likelihood of cracking and peeling. Moreover, one or more embodiments increase the amount of stress a semiconductor package structure can handle. Further, stiffener rings may provide global stress relief to the semiconductor package structure but may not provide adequate local stress relief. Layout of the stress relief structures in one or more embodiments provide for local stress relief and/or warpage control to the semiconductor package structure. Further still, one or more embodiments of the present disclosure improve the output yield and reliability.

It is understood that the stress relief structures 40 described above in conjunction with FIGS. 2, 4, and 5 are merely exemplary. In some embodiments, additional stress relief structures 40 (not shown) are disposed adjacent to the ones shown in these figures. The additional stress relief structures 40, in one or more embodiments, may have shapes exactly as those shown in the figures or shapes similar to those shown in the figures. Furthermore, the additional stress relief structure or structures 40, in one or more embodiments, is/are aligned or misaligned from those shown in the figures.

The present disclosure has described various exemplary embodiments. According to one embodiment, a semiconductor package structure, comprises a substrate, a die region having one or more dies disposed on the substrate, and at least one stress relief structure disposed at one or more corners of the substrate, the at least one stress relief structure being adjacent to at least one die.

An aspect of this description relates to a package. The package includes a substrate. The package further includes a first die on the substrate. The package further includes a second die on the substrate. The package further includes a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance. The package further includes a second stress relief structure on the substrate, wherein a distance between the second stress relief structure is the first distance, and the second stress relief structure is separated from the first stress relief structure. In some embodiments, the package further includes a third die on the substrate, wherein the third die is separate from the first die and the second die. In some embodiments, the third die has a different size from both the first die and the second die. In some embodiments, a distance between the third die and a closest stress relief structure is a second distance different from the first distance. In some embodiments, the package further includes a third stress relief structure, wherein the third die is between the first die and the third stress relief structure. In some embodiments, the first die is larger than the third die. In some embodiments, the first stress relief structure is along a single edge of the substrate. In some embodiments, the second stress relief structure extends along two edges of the substrate.

An aspect of this description relates to a method. The method includes bonding a first die to a substrate. The method further includes bonding a second die to the substrate. The method further includes adhering a first stress relief structure to the substrate, wherein a distance between the first stress relief structure to the first die is a first distance. The method further includes adhering a second stress relief structure to the substrate after adhering the first stress relief structure to the substrate, wherein a distance between the second stress relief structure is the first distance. In some embodiments, the method further includes curing an adhesive following adhering the first stress relief structure and the second stress relief structure to the substrate. In some embodiments, adhering the first stress relief structure to the substrate includes using an adhesive having a thermal conductivity greater than about 10 watts per meter Celsius (w/m-C). In some embodiments, adhering the second stress relief structure to the substrate includes adhering the second stress relief structure having a different composition from the first stress relief structure. In some embodiments, bonding the first die to the substrate includes using flip-chip bonding. In some embodiments, bonding the first die to the substrate includes using wire bonding. In some embodiments, adhering the first stress relief structure to the substrate includes adhering the first stress relief structure along a single side of the substrate. In some embodiments, adhering the second stress relief structure to the substrate includes adhering the second stress relief structure to a corner of the substrate.

An aspect of this description relates to a package. The package includes a first die having a first size. The package further includes a second die having a second size less than the first die. The package further includes a first stress relief structure adjacent to a first corner of the first die. The package further includes a second stress relief structure adjacent to a second corner of the first die, wherein each of the first stress relief structure and the second stress relief structure is between the first die and the second die, and the first stress relief structure is separated from the second stress relief structure. The package further includes a stiffener ring, wherein the stiffener ring is continuous, and the stiffener ring surrounds the first die and the second die. In some embodiments, the package further includes a third die, wherein the first stress relief structure is between the first die and the third die. In some embodiments, the package further includes a third stress relief structure adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the third die. In some embodiments, the package further includes a third stress relief structure adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the stiffener ring.

In the preceding detailed description, specific exemplary embodiments have been described. It will, however, be apparent to a person of ordinary skill in the art that various modifications, structures, processes, and changes may be made thereto without departing from the broader spirit and scope of the present disclosure. The specification and drawings are, accordingly, to be regarded as illustrative and not restrictive. It is understood that embodiments of the present disclosure are capable of using various other combinations and environments and are capable of changes or modifications within the scope of the claims. 

What is claimed is:
 1. A package comprising: a substrate; a first die on the substrate; a second die on the substrate; a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance; and a second stress relief structure on the substrate, wherein a distance between the second stress relief structure is the first distance, and the second stress relief structure is separated from the first stress relief structure.
 2. The package of claim 1, further comprising a third die on the substrate, wherein the third die is separate from the first die and the second die.
 3. The package of claim 2, wherein the third die has a different size from both the first die and the second die.
 4. The package of claim 2, wherein a distance between the third die and a closest stress relief structure is a second distance different from the first distance.
 5. The package of claim 2, further comprising a third stress relief structure, wherein the third die is between the first die and the third stress relief structure.
 6. The package of claim 2, wherein the first die is larger than the third die.
 7. The package of claim 1, wherein the first stress relief structure is along a single edge of the substrate.
 8. The package of claim 1, wherein the second stress relief structure extends along two edges of the substrate.
 9. A method comprising: bonding a first die to a substrate; bonding a second die to the substrate; adhering a first stress relief structure to the substrate, wherein a distance between the first stress relief structure to the first die is a first distance; and adhering a second stress relief structure to the substrate after adhering the first stress relief structure to the substrate, wherein a distance between the second stress relief structure is the first distance.
 10. The method of claim 9, further comprising curing an adhesive following adhering the first stress relief structure and the second stress relief structure to the substrate.
 11. The method of claim 9, wherein adhering the first stress relief structure to the substrate comprises using an adhesive having a thermal conductivity greater than about 10 watts per meter Celsius (w/m-C).
 12. The method of claim 9, wherein adhering the second stress relief structure to the substrate comprises adhering the second stress relief structure having a different composition from the first stress relief structure.
 13. The method of claim 9, wherein bonding the first die to the substrate comprises using flip-chip bonding.
 14. The method of claim 9, wherein bonding the first die to the substrate comprises using wire bonding.
 15. The method of claim 9, wherein adhering the first stress relief structure to the substrate comprises adhering the first stress relief structure along a single side of the substrate.
 16. The method of claim 9, wherein adhering the second stress relief structure to the substrate comprises adhering the second stress relief structure to a corner of the substrate.
 17. A package comprising: a first die having a first size; a second die having a second size less than the first die; a first stress relief structure adjacent to a first corner of the first die; a second stress relief structure adjacent to a second corner of the first die, wherein each of the first stress relief structure and the second stress relief structure is between the first die and the second die, and the first stress relief structure is separated from the second stress relief structure; and a stiffener ring, wherein the stiffener ring is continuous, and the stiffener ring surrounds the first die and the second die.
 18. The package of claim 17, further comprising a third die, wherein the first stress relief structure is between the first die and the third die.
 19. The package of claim 18, further comprising a third stress relief structure adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the third die.
 20. The package of claim 17, further comprising a third stress relief structure adjacent to a third corner of the first die, wherein the third stress relief structure is between the first die and the stiffener ring. 